Invention Grant
- Patent Title: MEMS packaging with improved reaction to temperature changes
- Patent Title (中): MEMS封装具有改善的温度变化反应
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Application No.: US11033076Application Date: 2005-01-11
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Publication No.: US07642628B2Publication Date: 2010-01-05
- Inventor: William T. Anderson , David Strei
- Applicant: William T. Anderson , David Strei
- Applicant Address: US MN Eden Prairie
- Assignee: Rosemount Inc.
- Current Assignee: Rosemount Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Westman, Champlin & Kelley, P.A.
- Agent Christopher R. Christenson
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.
Public/Granted literature
- US20060151864A1 MEMS packaging with improved reaction to temperature changes Public/Granted day:2006-07-13
Information query
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