Invention Grant
- Patent Title: Stacked MEMS device
- Patent Title (中): 堆叠的MEMS器件
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Application No.: US11960271Application Date: 2007-12-19
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Publication No.: US07642657B2Publication Date: 2010-01-05
- Inventor: Liam O Suilleabhain , Raymond Goggin , Eva Murphy , Kieran P. Harney
- Applicant: Liam O Suilleabhain , Raymond Goggin , Eva Murphy , Kieran P. Harney
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
Public/Granted literature
- US20080157339A1 Stacked MEMS Device Public/Granted day:2008-07-03
Information query
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