Invention Grant
- Patent Title: Frame assembly for electrical bond
- Patent Title (中): 电接线框架组件
-
Application No.: US12046768Application Date: 2008-03-12
-
Publication No.: US07642975B2Publication Date: 2010-01-05
- Inventor: Ralph D. Brunks , Scott M. Mortensen
- Applicant: Ralph D. Brunks , Scott M. Mortensen
- Applicant Address: US CT Stratford
- Assignee: Sikorsky Aircraft Corporation
- Current Assignee: Sikorsky Aircraft Corporation
- Current Assignee Address: US CT Stratford
- Agency: Carlson, Gaskey & Olds
- Main IPC: H01Q1/28
- IPC: H01Q1/28
Abstract:
A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
Public/Granted literature
- US20090231218A1 FRAME ASSEMBLY FOR ELECTRICAL BOND Public/Granted day:2009-09-17
Information query
