Invention Grant
US07643081B2 Digital camera module with small sized image sensor chip package
有权
数码相机模块具有小尺寸图像传感器芯片封装
- Patent Title: Digital camera module with small sized image sensor chip package
- Patent Title (中): 数码相机模块具有小尺寸图像传感器芯片封装
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Application No.: US11402467Application Date: 2006-04-12
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Publication No.: US07643081B2Publication Date: 2010-01-05
- Inventor: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
- Applicant: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
- Applicant Address: TW Chu-Nan, Miao-Li Hsien
- Assignee: Altus Technology Inc.
- Current Assignee: Altus Technology Inc.
- Current Assignee Address: TW Chu-Nan, Miao-Li Hsien
- Agent Zhigang Ma
- Priority: CN200510035554 20050624
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
Public/Granted literature
- US20060290802A1 Digital camera module with small sized image sensor chip package Public/Granted day:2006-12-28
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