Invention Grant
- Patent Title: Method of setting focus condition at time of exposure, apparatus for setting focus condition at time of exposure, program, and computer readable recording medium
- Patent Title (中): 在曝光时设定对焦条件的方法,曝光时设定对焦条件的设备,程序和计算机可读记录介质
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Application No.: US11362126Application Date: 2006-02-27
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Publication No.: US07643126B2Publication Date: 2010-01-05
- Inventor: Michio Tanaka , Masahide Tadokoro
- Applicant: Michio Tanaka , Masahide Tadokoro
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-059590 20050303
- Main IPC: G03B27/42
- IPC: G03B27/42

Abstract:
In the present invention, in the photolithography process in which a certain focus condition has been already set, a film on a substrate is exposed to only zero-order light of a light source transmitted, and then developed to reduce a first portion of the film on the substrate. Further, the film on the substrate is exposed to zero-order light and higher order light of the light source transmitted, and then developed to reduce a second portion of the film on the substrate. Thereafter, the film thicknesses of the first portion and the second portion are measured, and the measured film thicknesses of the first portion and the second portion are converted into line widths of a resist pattern by previously obtained correlations between the film thicknesses and the line widths. The converted line width of the second portion is then subtracted from the converted line width of the first portion, whereby the line width depending only on the focus component is calculated. Based on the line width, a new focus condition is set.
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