Invention Grant
US07643259B2 Substrate, with ESD magnetically induced wires, bound to passives/product ICS
有权
衬底，具有ESD磁感应线，绑定到无源/产品ICS
- Patent Title: Substrate, with ESD magnetically induced wires, bound to passives/product ICS
- Patent Title (中): 衬底，具有ESD磁感应线，绑定到无源/产品ICS
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Application No.: US11513539Application Date: 2006-08-31
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Publication No.: US07643259B2Publication Date: 2010-01-05
- Inventor: Harold D Goodpaster
- Applicant: Harold D Goodpaster
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H02H9/00
- IPC: H02H9/00
Abstract:
A device is protected from induced or unexpected current spikes or surges, by receiving the current spikes through a conducting wire. The conducting wire is placed adjacent to a parallel conducting wire having opposing current flow. Magnetic fluxes in either conducting wire create induced currents that reduce the current in the other conducting wire.
Public/Granted literature
- US20080062601A1 Magnetic techniques to address electrostatic discharge Public/Granted day:2008-03-13
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