Invention Grant
US07643284B2 Housing temperature suppressing structure in electronic device and portable computer
有权
电子设备和便携式计算机中的外壳温度抑制结构
- Patent Title: Housing temperature suppressing structure in electronic device and portable computer
- Patent Title (中): 电子设备和便携式计算机中的外壳温度抑制结构
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Application No.: US11927381Application Date: 2007-10-29
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Publication No.: US07643284B2Publication Date: 2010-01-05
- Inventor: Fusanobu Nakamura
- Applicant: Fusanobu Nakamura
- Applicant Address: SG Singapore
- Assignee: Lenovo Singapore Pte. Ltd
- Current Assignee: Lenovo Singapore Pte. Ltd
- Current Assignee Address: SG Singapore
- Agency: Kunzler & McKenzie
- Priority: JP2006-293408 20061030
- Main IPC: H05K7/10
- IPC: H05K7/10 ; G06F1/20

Abstract:
The present invention provides a portable computer in which an increase in temperature of a housing is suppressed. In the present invention, a guide plate is provided to suppress an increase in temperature of a bottom surface. When a cooling fan device operates, outside air taken in from inlet openings flows as an air current through a narrow flow path formed between the guide plate and the bottom surface. A flow velocity of the air current can be increased by narrowing the flow path, and heat exchange with the guide plate can be effectively performed, thereby sufficiently cooling a cooling surface. The cooled guide plate cools an air layer between the guide plate and the heat sink and thermally insulates between the air layer and the bottom surface.
Public/Granted literature
- US20080112130A1 HOUSING TEMPERATURE SUPPRESSING STRUCTURE IN ELECTRONIC DEVICE AND PORTABLE COMPUTER Public/Granted day:2008-05-15
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