Invention Grant
US07643290B1 Techniques utilizing thermal, EMI and FIPS friendly electronic modules
有权
使用热,EMI和FIPS友好电子模块的技术
- Patent Title: Techniques utilizing thermal, EMI and FIPS friendly electronic modules
- Patent Title (中): 使用热,EMI和FIPS友好电子模块的技术
-
Application No.: US12178060Application Date: 2008-07-23
-
Publication No.: US07643290B1Publication Date: 2010-01-05
- Inventor: Susheela N. Narasimhan , Hang Tran , Branimir Tasic , John Borg , Wingo Cheong , Nguyen Nguyen
- Applicant: Susheela N. Narasimhan , Hang Tran , Branimir Tasic , John Borg , Wingo Cheong , Nguyen Nguyen
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: BainwoodHuang
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.
Public/Granted literature
- US20100020486A1 TECHNIQUES UTILIZING THERMAL, EMI AND FIPS FRIENDLY ELECTRONIC MODULES Public/Granted day:2010-01-28
Information query