Invention Grant
US07643290B1 Techniques utilizing thermal, EMI and FIPS friendly electronic modules 有权
使用热,EMI和FIPS友好电子模块的技术

Techniques utilizing thermal, EMI and FIPS friendly electronic modules
Abstract:
An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.
Information query
Patent Agency Ranking
0/0