A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.