In an assembly of an electronic device and a heat-dissipating module, the electronic device includes an electronic component disposed within a housing provided with an air outlet port, and the heat-dissipating module includes a heat-dissipating fin base disposed within the housing adjacent to the air outlet port, and a dust removing mechanism disposed on the heat-dissipating fin base. The heat-dissipating fin base includes two spaced-apart upright sidewalls, and a plurality of heat-dissipating fins arranged between the upright sidewalls. The dust removing mechanism includes a scraping plate disposed between the upright sidewalls and accessible outwardly of the air outlet port. The scraping plate has scraping teeth extending respectively into clearances among the heat-dissipating fins. By manipulating the scraping plate to displace upwardly and downwardly relative to the heat-dissipating fin base, dust that accumulates among the heat-dissipating fins can be scraped off.