Invention Grant
- Patent Title: Clip for heat sink
- Patent Title (中): 夹子为散热片
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Application No.: US11840222Application Date: 2007-08-17
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Publication No.: US07643299B2Publication Date: 2010-01-05
- Inventor: Hsiu-Chang Lai , Hung-Yi Wu , Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- Applicant: Hsiu-Chang Lai , Hung-Yi Wu , Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610201052 20061031
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms respectively for engaging with the circuit board.
Public/Granted literature
- US20080101029A1 CLIP FOR HEAT SINK Public/Granted day:2008-05-01
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