Invention Grant
US07643301B1 Heat exchanger system and method for circulating external air about a chipset
有权
热交换器系统以及围绕芯片组循环外部空气的方法
- Patent Title: Heat exchanger system and method for circulating external air about a chipset
- Patent Title (中): 热交换器系统以及围绕芯片组循环外部空气的方法
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Application No.: US11841570Application Date: 2007-08-20
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Publication No.: US07643301B1Publication Date: 2010-01-05
- Inventor: Zhihai Zack Yu , Tommy C. Lee
- Applicant: Zhihai Zack Yu , Tommy C. Lee
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.
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