Invention Grant
- Patent Title: Method and apparatus for efficient coupling between silicon photonic chip and optical fiber
- Patent Title (中): 硅光子芯片与光纤之间有效耦合的方法和装置
-
Application No.: US12212424Application Date: 2008-09-17
-
Publication No.: US07643710B1Publication Date: 2010-01-05
- Inventor: Ansheng Liu
- Applicant: Ansheng Liu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G02B6/26
- IPC: G02B6/26

Abstract:
A method and apparatus for efficient coupling between a silicon photonic chip and an optical fiber is described. In one embodiment, an apparatus according to embodiments of the present invention includes: a first optical waveguide having a first end to optically couple to a first external device and a second end, the second end having a taper with a tip at the second end, a second optical waveguide optically coupled to the taper of the first optical waveguide, having a taper with a tip at a second end, and a third optical waveguide optically coupled to the taper of the second optical waveguide, the third optical waveguide to optically couple to a second external device having a larger cross-sectional area than the first external device.
Information query