Invention Grant
- Patent Title: Semiconductor integrated circuit device and method of testing the same
- Patent Title (中): 半导体集成电路器件及其测试方法
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Application No.: US11727452Application Date: 2007-03-27
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Publication No.: US07644325B2Publication Date: 2010-01-05
- Inventor: Tsuneo Abe
- Applicant: Tsuneo Abe
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2006-087926 20060328
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/30
Abstract:
A semiconductor integrated circuit device includes a control circuit configured to generate a control code to control a parameter of a predetermined circuit and outputs the control code to the predetermined circuit; and a latch circuit connected with an output of the control circuit to latch the control code in response to a control signal. The latch circuit may be provided between the control circuit and the predetermined circuit to latch the control code or transfer the control code to the predetermined circuit, in response to the control signal.
Public/Granted literature
- US20070245186A1 Semiconductor integrated circuit device and method of testing the same Public/Granted day:2007-10-18
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