Invention Grant
- Patent Title: Device for assembling composite structure incorporating flipper assemblies
- Patent Title (中): 装配导板组件的复合结构装置
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Application No.: US11582217Application Date: 2006-10-17
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Publication No.: US07644491B2Publication Date: 2010-01-12
- Inventor: Joseph E. Absalonson
- Applicant: Joseph E. Absalonson
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Tung & Associates
- Main IPC: B25B11/00
- IPC: B25B11/00

Abstract:
A device for assembling a composite structure is disclosed. An illustrative embodiment of the device includes a table module, a first plurality of flipper devices carried by the table module and a second plurality of flipper devices carried by the table module in adjacent and adjustable relationship with respect to the first plurality of flipper devices, respectively. The first plurality of flipper devices and the second plurality of flipper devices are capable of accommodating a variation in thickness of the composite structure.
Public/Granted literature
- US20080092372A1 Device for assembling composite structure incorporating flipper assemblies Public/Granted day:2008-04-24
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