Invention Grant
US07644495B2 Method of forming a conductive device using conductive resin-base materials 失效
使用导电树脂基材料形成导电器件的方法

  • Patent Title: Method of forming a conductive device using conductive resin-base materials
  • Patent Title (中): 使用导电树脂基材料形成导电器件的方法
  • Application No.: US11800131
    Application Date: 2007-05-04
  • Publication No.: US07644495B2
    Publication Date: 2010-01-12
  • Inventor: Thomas Aisenbrey
  • Applicant: Thomas Aisenbrey
  • Applicant Address: US WA Bellingham
  • Assignee: Integral Technologies, Inc.
  • Current Assignee: Integral Technologies, Inc.
  • Current Assignee Address: US WA Bellingham
  • Agent Douglas R. Schnabel
  • Main IPC: H01R9/00
  • IPC: H01R9/00
Method of forming a conductive device using conductive resin-base materials
Abstract:
Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
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