Invention Grant
- Patent Title: Humidity sensor having humidity sensitive film and method for manufacturing the same
- Patent Title (中): 具有湿敏膜的湿度传感器及其制造方法
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Application No.: US11589947Application Date: 2006-10-31
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Publication No.: US07644615B2Publication Date: 2010-01-12
- Inventor: Naoki Arisaka
- Applicant: Naoki Arisaka
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2005-322887 20051107
- Main IPC: G01N27/22
- IPC: G01N27/22

Abstract:
A humidity sensor includes: a sensor chip including a capacitive humidity sensor element and a connection electrode, wherein the capacitive humidity sensor element includes a humidity sensitive film having relative permittivity changeable in accordance with humidity, and wherein the connection electrode is electrically connected to the humidity sensor element; a lead plate electrically connected to the connection electrode; and a mold for covering a connection portion between the connection electrode and the lead plate. The mold is disposed on the sensor chip and includes a groove. The humidity sensitive film is disposed in the groove. The humidity sensitive film has a height in the groove, the height equal to or lower than a surface of the mold. The height of the humidity sensitive film in the groove is homogeneous.
Public/Granted literature
- US20070113648A1 Humidity sensor having humidity sensitive film and method for manufacturing the same Public/Granted day:2007-05-24
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