Invention Grant
- Patent Title: Sensor comprising a modular connection
- Patent Title (中): 传感器包括模块化连接
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Application No.: US10586625Application Date: 2005-01-18
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Publication No.: US07644620B2Publication Date: 2010-01-12
- Inventor: Christopherus Bader
- Applicant: Christopherus Bader
- Applicant Address: CH Schaffhausen
- Assignee: Priamus System Technologies AG
- Current Assignee: Priamus System Technologies AG
- Current Assignee Address: CH Schaffhausen
- Agency: Bachman & LaPointe, P.C.
- Priority: DE102004003278 20040121
- International Application: PCT/EP2005/000409 WO 20050118
- International Announcement: WO2005/071379 WO 20050804
- Main IPC: G01L7/00
- IPC: G01L7/00
Abstract:
A sensor comprising a base body and a sensor element, in particular for transforming and/or transferring measuring variables. The sensor element is associated with a receiving element.
Public/Granted literature
- US20080223144A1 Sensor Public/Granted day:2008-09-18
Information query
