Invention Grant
- Patent Title: Audio jack having dustproof film
- Patent Title (中): 音频插孔具有防尘膜
-
Application No.: US12156881Application Date: 2008-06-04
-
Publication No.: US07645170B2Publication Date: 2010-01-12
- Inventor: Ji-En Long , Hai-Qiu Lu
- Applicant: Ji-En Long , Hai-Qiu Lu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Priority: TW96209155 20070604
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
An audio jack comprises a housing and a plurality of contacts received in the housing. The housing defines a receiving hole along the longitudinal direction of the housing, and the face of the housing has at least an opening communicating with the receiving hole. The contacts at least include a deflectable contact and a fixed contact. The audio jack includes at least a dustproof film covering said opening so as to prevent the dust invading the interior of the audio jack.
Public/Granted literature
- US20080299837A1 Audio jack having dustproof film Public/Granted day:2008-12-04
Information query