Invention Grant
- Patent Title: Substrate delivery mechanism
- Patent Title (中): 基材输送机制
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Application No.: US11826628Application Date: 2007-07-17
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Publication No.: US07645185B2Publication Date: 2010-01-12
- Inventor: Soichi Isobe , Hideo Aizawa , Hiroomi Torii , Daisuke Koga , Satoshi Wakabayashi
- Applicant: Soichi Isobe , Hideo Aizawa , Hiroomi Torii , Daisuke Koga , Satoshi Wakabayashi
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2002/096437 20020329; JP2002/185212 20020625
- Main IPC: B24B7/00
- IPC: B24B7/00

Abstract:
A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.
Public/Granted literature
- US20070264914A1 Substrate delivery mechanism Public/Granted day:2007-11-15
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