A method of forming a pattern is disclosed, which can improve the interfacial properties between a soft mold and a substrate including a pattern-formation material, the method comprising loading a substrate coated with a pattern-formation material into a chamber; positioning a soft mold, whose surface is provided with embossing and depressed patterns, in opposite to the substrate inside the chamber; forming an adsorption layer by evaporating some components of the pattern-formation material and adsorbing the components evaporated from the pattern-formation material to the surface of soft mold; forming a pattern layer with a shape being inverted to the embossing and depressed patterns included in the surface of soft mold by bring the soft mold including the adsorption layer into contact with the remaining pattern-formation material; and separating the soft mold from the pattern layer.