Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the semiconductor device
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Application No.: US11446393Application Date: 2006-06-05
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Publication No.: US07645655B2Publication Date: 2010-01-12
- Inventor: Yukimune Watanabe , Shinji Migita , Nobuyuki Mise
- Applicant: Yukimune Watanabe , Shinji Migita , Nobuyuki Mise
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Seiko Epson Corporation,Renesas Technology Corporation
- Current Assignee: Seiko Epson Corporation,Renesas Technology Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-169631 20050609
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device includes a semiconductor layer formed on an insulating layer; a gate electrode disposed on said semiconductor layer via a gate insulating film; a source/drain layer composed by including an alloy layer or a metal layer with a bottom surface in contact with the insulating layer, with joint surfaces to a channel region disposed along crystal orientation faces of said semiconductor layer; and impurity-doped layers formed in a self-aligned manner along interfaces of the alloy layer or the metal layer, and said semiconductor layer.
Public/Granted literature
- US20060284220A1 Semiconductor device and manufacturing method of the semiconductor device Public/Granted day:2006-12-21
Information query
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