Invention Grant
- Patent Title: Bonding interface quality by cold cleaning and hot bonding
- Patent Title (中): 通过冷清和热粘合粘合界面质量
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Application No.: US11873311Application Date: 2007-10-16
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Publication No.: US07645682B2Publication Date: 2010-01-12
- Inventor: Sebastien Kerdiles , Willy Michel , Walter Schwarzenbach , Daniel Delprat
- Applicant: Sebastien Kerdiles , Willy Michel , Walter Schwarzenbach , Daniel Delprat
- Applicant Address: FR Bernin
- Assignee: S.O.I.Tec Silicon on Insulator Technologies
- Current Assignee: S.O.I.Tec Silicon on Insulator Technologies
- Current Assignee Address: FR Bernin
- Agency: Winston & Strawn LLP
- Priority: FR0753318 20070216
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/46 ; H01L21/30 ; H01L21/461
Abstract:
The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.
Public/Granted literature
- US20080200008A1 BONDING INTERFACE QUALITY BY COLD CLEANING AND HOT BONDING Public/Granted day:2008-08-21
Information query
IPC分类:
