The present invention relates to a method for bonding a first thin plate having a first adhesion surface and a first back surface and a second thin plate having a second adhesion surface and a second back surface by an adhesive, the adhesive being sandwiched between said first adhesion surface and said second adhesion surface. The method comprises the steps of: applying said adhesive to said second adhesion surface of said second thin plate; holding said first thin plate by applying negative pressure to said first back surface, wherein said first thin plate is held at said first back surface, and said first adhesion surface faces downward; holding said second thin plate by applying negative pressure to said second back surface, wherein said second thin plate is held at said second back surface, and said second adhesion surface faces upward; temporarily bonding said first thin plate and said second thin plate by putting said first and second adhesion surfaces into contact with each other, wherein said first thin plate and said second thin plate are held by negative pressure; and bonding said first thin plate and said second thin plate by curing said adhesive, wherein said first thin plate and said second thin plate are temporarily bonded.