Invention Grant
US07646020B2 Apparatus for observing an assembled state of components and method of observing an assembled state of components using such apparatus
失效
用于观察组件的组装状态的装置和使用这种装置观察组件的组装状态的方法
- Patent Title: Apparatus for observing an assembled state of components and method of observing an assembled state of components using such apparatus
- Patent Title (中): 用于观察组件的组装状态的装置和使用这种装置观察组件的组装状态的方法
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Application No.: US11849069Application Date: 2007-08-31
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Publication No.: US07646020B2Publication Date: 2010-01-12
- Inventor: Shuichi Takeuchi , Hidehiko Kira
- Applicant: Shuichi Takeuchi , Hidehiko Kira
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey
- Priority: JP2006-324182 20061130
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/20 ; H01L31/036 ; H01L23/52 ; H01L23/48 ; H01L29/40 ; H01L21/66 ; H01L21/50 ; H01L21/48
Abstract:
When bonding a workpiece to a substrate, processed parts of the substrate and the workpiece are observed and behavior such as the production of voids and the flowing of resin is observed. An apparatus for observing an assembled state of components includes: a stage on which a substrate is set; a head mechanism that bonds, by applying heat and pressure, an observation workpiece made of a transparent material to the substrate via resin supplied between the substrate and the observation workpiece; a light source that irradiates an observed part of the substrate and the observation workpiece mounted on the stage with light; and a camera that takes, from the observation workpiece side, an image of the observed part when the observation workpiece is bonded to the substrate set on the stage.
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