Invention Grant
US07646063B1 Compact CMOS ESD layout techniques with either fully segmented salicide ballasting (FSSB) in the source and/or drain regions
有权
紧凑型CMOS ESD布局技术,在源极和/或漏极区域具有完全分段的自对准沉积(FSSB)
- Patent Title: Compact CMOS ESD layout techniques with either fully segmented salicide ballasting (FSSB) in the source and/or drain regions
- Patent Title (中): 紧凑型CMOS ESD布局技术,在源极和/或漏极区域具有完全分段的自对准沉积(FSSB)
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Application No.: US11451610Application Date: 2006-06-12
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Publication No.: US07646063B1Publication Date: 2010-01-12
- Inventor: Graeme B. Boyd , William M. Lye , Xun Cheng
- Applicant: Graeme B. Boyd , William M. Lye , Xun Cheng
- Applicant Address: US CA Santa Clara
- Assignee: PMC-Sierra, Inc.
- Current Assignee: PMC-Sierra, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
Transistor structures for relatively even current balancing within a device and methods for fabricating the same are disclosed. These devices can be used in relatively compact MOSFET Electrostatic Discharge (ESD) protection structures, such as in snapback devices. One embodiment utilizes a salisided exclusion layer for segmentation of the source and/or drain diffusion areas, while the others utilize poly for segmentation of the source and/or drain area. Also, diffusion is used generically herein and, for example, includes implants. These techniques provide relatively good ESD tolerance while consuming a relatively small amount of area, and provide significant area and parasitic capacitance reduction over the state of the art without sacrificing ESD performance. These techniques are also applicable to current balancing within relatively high current devices, such as drivers.
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