Invention Grant
- Patent Title: Semiconductor die with aluminum-spiked heat pipes
- Patent Title (中): 半导体模具采用铝合金加热管
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Application No.: US11588743Application Date: 2006-10-27
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Publication No.: US07646064B1Publication Date: 2010-01-12
- Inventor: Visvamohan Yegnashankaran
- Applicant: Visvamohan Yegnashankaran
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Mark C. Pickering
- Main IPC: H01L31/112
- IPC: H01L31/112
Abstract:
A low thermal pathway is provided from the top surface of a silicon substrate to the bottom surface of the silicon substrate by first forming aluminum plugs in the bottom surface of the silicon substrate that contact the silicon substrate and extend up towards the top surface, and then heating the aluminum plugs to a temperature for a period of time sufficient to cause spikes to grow from the sides of the aluminum plugs.
Information query
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