Invention Grant
US07646065B2 Semiconductor device including fully-silicided (FUSI) gate electrodes
有权
半导体器件包括全硅化(FUSI)栅电极
- Patent Title: Semiconductor device including fully-silicided (FUSI) gate electrodes
- Patent Title (中): 半导体器件包括全硅化(FUSI)栅电极
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Application No.: US11542269Application Date: 2006-10-04
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Publication No.: US07646065B2Publication Date: 2010-01-12
- Inventor: Naoki Kotani , Gen Okazaki , Shinji Takeoka , Junji Hirase , Akio Sebe , Kazuhiko Aida
- Applicant: Naoki Kotani , Gen Okazaki , Shinji Takeoka , Junji Hirase , Akio Sebe , Kazuhiko Aida
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-293268 20051006
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device includes: an isolation region formed in a semiconductor substrate; an active region surrounded by the isolation region in the semiconductor substrate; a gate insulating film formed on the active region; and a gate electrode formed across the boundary between the active region and the isolation region adjacent to the active region. The gate electrode includes a first portion which is located above the active region with the gate insulating film interposed therebetween and is entirely made of a silicide in a thickness direction and a second portion which is located above the isolation region and is made of a silicon region and the silicide region covering the silicon region.
Public/Granted literature
- US20070080405A1 Semiconductor device and method for fabricating the same Public/Granted day:2007-04-12
Information query
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