Invention Grant
- Patent Title: Die saw crack stopper
- Patent Title (中): 模锯裂缝塞
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Application No.: US11654428Application Date: 2007-01-17
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Publication No.: US07646078B2Publication Date: 2010-01-12
- Inventor: Shin-Puu Jeng , Shih-Hsun Hsu
- Applicant: Shin-Puu Jeng , Shih-Hsun Hsu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/544
- IPC: H01L23/544

Abstract:
A novel die saw crack stopper that consists of placing formations into the scribe line of multiple metal layers of a die. These formations comprise multiple right angle shapes that are interconnected at right angles. In an embodiment the formations have an overall shape that has a special meaning, such as a single right angle “z” shape along with a discontinuous cross piece, two interlocking right angle “z” shapes, “t”, multiple sets of parallel lines perpendicular to each other, with one set having a line that only intersects a single line from the other set, or the like. The formations in a single layer can be placed such that they are located adjacent to each other along an axis that runs substantially parallel with the scribe line. These formations can also be connected to other formations in other metal layers located either above or below the formation.
Public/Granted literature
- US20080169533A1 Die saw crack stopper Public/Granted day:2008-07-17
Information query
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