Invention Grant
US07646090B2 Semiconductor module for making electrical contact with a connection device via a rewiring device
失效
半导体模块，用于经由重新布线装置与连接装置进行电接触
- Patent Title: Semiconductor module for making electrical contact with a connection device via a rewiring device
- Patent Title (中): 半导体模块，用于经由重新布线装置与连接装置进行电接触
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Application No.: US11364770Application Date: 2006-02-28
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Publication No.: US07646090B2Publication Date: 2010-01-12
- Inventor: Harry Hedler , Roland Irsigler , Thorsten Meyer
- Applicant: Harry Hedler , Roland Irsigler , Thorsten Meyer
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Fay Kaplun & Marcin, LLP
- Priority: DE10345395 20030930
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/12 ; H01L23/053 ; H01L23/48
Abstract:
The present invention provides a semiconductor module having: a semiconductor device (10) having a contact device (11) for making electrical contact with a connection device (17; 20) via a rewiring device (15, 15′, 15″); and a carrier device (12, 13, 14) for mechanically coupling the semiconductor device (10) to a connection device (17), the carrier device (12, 13, 14) having a gradient between a first modulus of elasticity at the semiconductor device (10) and a second, higher modulus of elasticity at the connection device (17; 20). The present invention likewise provides a method for producing a semiconductor module.
Public/Granted literature
- US20060177964A1 Semiconductor module and method for producing a semiconductor module Public/Granted day:2006-08-10
Information query
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