Invention Grant
- Patent Title: Bond pads and methods for fabricating the same
- Patent Title (中): 接合垫及其制造方法
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Application No.: US11246088Application Date: 2005-10-11
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Publication No.: US07646097B2Publication Date: 2010-01-12
- Inventor: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
- Applicant: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
Public/Granted literature
- US20070080460A1 Bond pads and methods for fabricating the same Public/Granted day:2007-04-12
Information query
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