Invention Grant
- Patent Title: Semiconductor integrated circuit and method of production of same
- Patent Title (中): 半导体集成电路及其制作方法
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Application No.: US11482808Application Date: 2006-07-10
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Publication No.: US07646209B2Publication Date: 2010-01-12
- Inventor: Mitsuhiro Oomori , Tomofumi Arakawa
- Applicant: Mitsuhiro Oomori , Tomofumi Arakawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2005-202818 20050712
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H03K19/007

Abstract:
A semiconductor integrated circuit, able to repair a fault and normally operate as an overall circuit even when a fault occurs in a portion of the circuit, and able to reduce a change of signal delay along with the repair of the fault, including N (larger than 2) number of circuit modules which can replace each other's functions; circuit blocks each including R (larger than 1 but smaller than N) number of I/O units for outputting at least one signal to one circuit module, and receiving at least one signal generated in the one circuit module; and a circuit module selection unit configured to select R number of circuit modules from among the N number of circuit modules in response to a control signal, connect the selected R number of circuit modules and R number of I/O units of the circuit block in a 1:1 correspondence, and connect one circuit module selected from at least two circuit modules in response to the control signal to each of the R number of I/O units, and a method of producing the same.
Public/Granted literature
- US20070234137A1 Semiconductor integrated circuit and method of production of same Public/Granted day:2007-10-04
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