Invention Grant
- Patent Title: Solid state image pickup device, method for producing the same, and image pickup system comprising the solid state image pickup device
- Patent Title (中): 固体摄像装置及其制造方法以及包括固体摄像装置的摄像系统
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Application No.: US11848398Application Date: 2007-08-31
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Publication No.: US07646493B2Publication Date: 2010-01-12
- Inventor: Akira Okita , Hiroki Hiyama , Hideaki Takada
- Applicant: Akira Okita , Hiroki Hiyama , Hideaki Takada
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2003-404544 20031203
- Main IPC: G01B11/14
- IPC: G01B11/14

Abstract:
A solid state image pickup device includes a light receiving area, a plurality of layers, and a light collecting unit disposed above the plurality of layers. The plurality of layers includes first and second layers, such that a pattern of the first layer is formed by a plurality of exposure shots each illuminating a different region, and a pattern of the second layer is formed by a one shot exposure. The patterns of the first and second layers have apertures corresponding to the light receiving area, and the light collecting unit and the aperture of the pattern of the second layer define a light path through which light is incident in the light receiving area, and the pattern of the first layer is disposed outside of the light path.
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