Invention Grant
- Patent Title: Multilayer feedthrough capacitor
- Patent Title (中): 多层馈通电容
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Application No.: US12051411Application Date: 2008-03-19
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Publication No.: US07646584B2Publication Date: 2010-01-12
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2007-087998 20070329
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/006

Abstract:
A capacitor body of a multilayer feedthrough capacitor is arranged with grounding inner electrodes and signal inner electrodes. The grounding inner electrodes include first and second grounding main electrode portions, grounding connection electrode portions having no areas opposing the signal inner electrodes, and first and second grounding lead electrode portions. The signal inner electrodes include first and second signal main electrode portions, signal connection electrode portions having no areas opposing the grounding inner electrodes, and first and second signal lead electrode portions.
Public/Granted literature
- US20080239624A1 Multilayer Feedthrough Capacitor Public/Granted day:2008-10-02
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