Invention Grant
- Patent Title: Semiconductor device with three-dimensional array structure
- Patent Title (中): 具有三维阵列结构的半导体器件
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Application No.: US11869140Application Date: 2007-10-09
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Publication No.: US07646664B2Publication Date: 2010-01-12
- Inventor: Hoo-Sung Cho , Soon-Moon Jung , Young-Seop Rah , Jae-Hoon Jang , Jae-Hun Jeong , Jun-Beom Park
- Applicant: Hoo-Sung Cho , Soon-Moon Jung , Young-Seop Rah , Jae-Hoon Jang , Jae-Hun Jeong , Jun-Beom Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2006-0098061 20061009; KR10-2007-0024088 20070312; KR10-2007-0058411 20070614
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
A semiconductor memory device including a memory cell array, a first row decoder adjacent the memory cell array, and a second row decoder adjacent the memory cell array. A memory cell array may include first and second memory cell blocks on respective first and second semiconductor layers. The first memory cell block may include a first word line coupled to a first row of memory cells on the first semiconductor layer, the second memory cell block may include a second word line coupled to a second row of memory cells on the second semiconductor layer, and the first word line may be between the first and second semiconductor layers. The first row decoder may be configured to control the first word line, and the second row decoder may be configured to control the second word line. A first wiring may electrically connect the first row decoder and the first word line, and a second wiring may electrically connect the second row decoder and the second word line.
Public/Granted literature
- US20080084729A1 SEMICONDUCTOR DEVICE WITH THREE-DIMENSIONAL ARRAY STRUCTURE Public/Granted day:2008-04-10
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