Invention Grant
- Patent Title: Upgradeable, modular data center cooling apparatus
- Patent Title (中): 可升级的模块化数据中心冷却设备
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Application No.: US10830503Application Date: 2004-04-22
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Publication No.: US07647787B2Publication Date: 2010-01-19
- Inventor: Christian L. Belady , Eric C. Peterson
- Applicant: Christian L. Belady , Eric C. Peterson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: F25D23/12
- IPC: F25D23/12

Abstract:
A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.
Public/Granted literature
- US20050235671A1 Upgradeable, modular data center cooling apparatus Public/Granted day:2005-10-27
Information query
IPC分类: