Invention Grant
- Patent Title: Injection mold assembly
- Patent Title (中): 注塑模组装
-
Application No.: US11954993Application Date: 2007-12-12
-
Publication No.: US07648117B2Publication Date: 2010-01-19
- Inventor: Wataru Oikawa , Tsuyoshi Namioka
- Applicant: Wataru Oikawa , Tsuyoshi Namioka
- Applicant Address: JP Nasu-gun
- Assignee: Nippon Platec Co., Ltd.
- Current Assignee: Nippon Platec Co., Ltd.
- Current Assignee Address: JP Nasu-gun
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-337724 20061215
- Main IPC: B29C45/26
- IPC: B29C45/26

Abstract:
A cavity is formed between stationary and movable mold members, and a runner is connected to a gate to the mold cavity to supply a molten resin material thereto. The stationary and movable mold members have bodies of an aluminum alloy of high heat conductivity and light weight. Iron base plating is applied at least to transfer wall surfaces of the cavity, leaving and exposing other wall surfaces in a non-plated state.
Public/Granted literature
- US20080145472A1 INJECTION MOLD ASSEMBLY Public/Granted day:2008-06-19
Information query