Invention Grant
- Patent Title: System and method for increasing the surface mounting stability of a lamp
- Patent Title (中): 增加灯的表面安装稳定性的系统和方法
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Application No.: US11950323Application Date: 2007-12-04
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Publication No.: US07648260B2Publication Date: 2010-01-19
- Inventor: Chai Kok-Soon , Wong Fu-Mauh
- Applicant: Chai Kok-Soon , Wong Fu-Mauh
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: F21V19/00
- IPC: F21V19/00

Abstract:
In one embodiment, an LED is constructed with its entire contact structure is stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend below the base of the molded lamp. The base of the molded lamp is made wide enough to give support to the entire structure. Using this concept, any excess contract structure is cutoff and there is no need for bending of the contract structure to form the contact portions. In some embodiments, the cross-sectional area of the lamp base is extended to increase stability of the lamp when the lamp base is mounted on a flat surface.
Public/Granted literature
- US20080085622A1 SYSTEM AND METHOD FOR INCREASING THE SURFACE MOUNTING STABILITY OF A LAMP Public/Granted day:2008-04-10
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