Invention Grant
- Patent Title: Performance testing apparatus for heat pipes
- Patent Title (中): 热管性能试验装置
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Application No.: US11309559Application Date: 2006-08-22
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Publication No.: US07648267B2Publication Date: 2010-01-19
- Inventor: Tay-Jian Liu , Chuen-Shu Hou , Chao-Nien Tung
- Applicant: Tay-Jian Liu , Chuen-Shu Hou , Chao-Nien Tung
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610061079 20060609
- Main IPC: G01K1/16
- IPC: G01K1/16 ; G01K25/00

Abstract:
A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
Public/Granted literature
- US20070286256A1 PERFORMANCE TESTING APPARATUS FOR HEAT PIPES Public/Granted day:2007-12-13
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