Invention Grant
US07648290B2 Modular solid-state laser platform based on coaxial package and corresponding assembly process
失效
基于同轴封装的模块化固态激光平台和相应的组装过程
- Patent Title: Modular solid-state laser platform based on coaxial package and corresponding assembly process
- Patent Title (中): 基于同轴封装的模块化固态激光平台和相应的组装过程
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Application No.: US11533000Application Date: 2006-09-19
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Publication No.: US07648290B2Publication Date: 2010-01-19
- Inventor: Jean-Philippe Feve , Thierry Hilt , Nicolas Landru , Magalie Maillard
- Applicant: Jean-Philippe Feve , Thierry Hilt , Nicolas Landru , Magalie Maillard
- Applicant Address: US CA Milpitas
- Assignee: JDS Uniphase Corporation
- Current Assignee: JDS Uniphase Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Pequignot + Myers LLC
- Agent Matthew A. Pequignot
- Main IPC: G02B6/36
- IPC: G02B6/36
Abstract:
Application of a modular coaxial package design, compatible with telecommunication passive component packaging, to microchip lasers, in particular to passively Q-switched microlasers, pumped with a fiber-coupled diode, is disclosed. The number of parts is thereby reduced while providing the adequate degrees of freedom for the active or passive alignment of the optical elements within the package.
Public/Granted literature
- US20070116082A1 Modular Solid-State Laser Platform Based On Coaxial Package And Corresponding Assembly Process Public/Granted day:2007-05-24
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