Invention Grant
- Patent Title: Polishing pad and chemical mechanical polishing apparatus
- Patent Title (中): 抛光垫和化学机械抛光装置
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Application No.: US11830925Application Date: 2007-07-31
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Publication No.: US07648410B2Publication Date: 2010-01-19
- Inventor: Jae Young Choi
- Applicant: Jae Young Choi
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Saliwanchik
- Priority: KR10-2006-077396 20060817
- Main IPC: B24B7/22
- IPC: B24B7/22
Abstract:
A polishing pad and a CMP apparatus are provided. The polishing pad includes a plurality of patterns formed of trenches having a predetermined size and may include a groove for slurry flow. The plurality of patterns can include herringbone shaped trenches in concentric rows, where the rows of herringbone shaped trenches alternate in direction.
Public/Granted literature
- US20080045125A1 Polishing Pad and Chemical Mechanical Polishing Apparatus Public/Granted day:2008-02-21
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