Invention Grant
- Patent Title: Filled skutterudites for advanced thermoelectric applications
- Patent Title (中): 用于先进热电应用的填充方刀
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Application No.: US10979005Application Date: 2004-11-01
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Publication No.: US07648552B2Publication Date: 2010-01-19
- Inventor: Jihui Yang , Gregory P. Meisner
- Applicant: Jihui Yang , Gregory P. Meisner
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations, Inc.
- Current Assignee: GM Global Technology Operations, Inc.
- Current Assignee Address: US MI Detroit
- Agency: Reising Ethington P.C.
- Main IPC: B22F1/00
- IPC: B22F1/00 ; H01L35/12 ; H01M4/24
Abstract:
A low-cost filled skutterudite for advanced thermoelectric applications is disclosed. The filled skutterudite uses the relatively low-cost mischmetal, either alone or in addition to rare earth elements, as a starting material for guest or filler atoms.
Public/Granted literature
- US20060016470A1 Filled skutterudites for advanced thermoelectric applications Public/Granted day:2006-01-26
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