Invention Grant
- Patent Title: Heat treating device and heat treating method
- Patent Title (中): 热处理装置及热处理方法
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Application No.: US12362418Application Date: 2009-01-29
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Publication No.: US07648600B2Publication Date: 2010-01-19
- Inventor: Yoshimasa Tanaka , Hisaki Koga , Kazuhiro Kawasaki
- Applicant: Yoshimasa Tanaka , Hisaki Koga , Kazuhiro Kawasaki
- Applicant Address: JP Tokyo
- Assignee: Neturen Co., Ltd.
- Current Assignee: Neturen Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: patenttm.us
- Priority: JP2003-295352 20030819
- Main IPC: H05B6/10
- IPC: H05B6/10

Abstract:
A heat treatment apparatus 10 comprises a supporting unit 20 for supporting a columnar workpiece 12 turnably, and an induction-heating coil 30 for induction-heating the workpiece 12 supported turnably by the supporting unit 20. Below the workpiece 12 supported by the supporting unit 20, a cooling tank 50 is provided which contains a liquid coolant. The workpiece 12 is made of steel such as carbon steel for mechanical structure, and spring steel. The workpiece 12 is made of a material which has a magnetic transformation point at 770° C. The material is ferromagnetic below this temperature, and becomes paramagnetic above this temperature.
Public/Granted literature
- US20090159157A1 HEAT TREATING DEVICE AND HEAT TREATING METHOD Public/Granted day:2009-06-25
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