A method and apparatus for electropolishing a conductive surface of a semiconductor wafer. The apparatus includes a polisher having at least one first electrode and at least one second electrode separated from one another by an isolation region. A moving mechanism rotates the wafer while the conductive surface of the wafer is moved linearly and parallel to a first direction, which varies an exposure of the relative surface areas of the conductive surface to the at least one first electrode and the at least one second electrode.