Invention Grant
- Patent Title: Low dielectric loss composite material
- Patent Title (中): 低介电损耗复合材料
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Application No.: US11671698Application Date: 2007-02-06
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Publication No.: US07648758B2Publication Date: 2010-01-19
- Inventor: Brian G. Morin
- Applicant: Brian G. Morin
- Applicant Address: US SC Greer
- Assignee: Innegrity, LLC
- Current Assignee: Innegrity, LLC
- Current Assignee Address: US SC Greer
- Agency: Wyatt, Tarrant & Combs, LLP
- Agent William S. Parks
- Main IPC: D02G3/00
- IPC: D02G3/00 ; D04H1/00

Abstract:
Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
Public/Granted literature
- US20080187734A1 Low Dielectric Loss Composite Material Public/Granted day:2008-08-07
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