Invention Grant
- Patent Title: Microstructure and method of manufacturing the same
- Patent Title (中): 微结构及其制造方法
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Application No.: US11702189Application Date: 2007-02-05
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Publication No.: US07648760B2Publication Date: 2010-01-19
- Inventor: Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
- Applicant: Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-052758 20060228
- Main IPC: C25D11/06
- IPC: C25D11/06 ; B32B3/26

Abstract:
In a method of manufacturing a microstructure, an aluminum member having an aluminum substrate and a micropore-bearing anodized layer present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving 0.001 to 20 wt % of a material constituting the anodized layer and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized layer, thereby obtaining the microstructure having micropores formed on a surface thereof. This method enables a microstructure having an ordered array of pits to be obtained in a short period of time.
Public/Granted literature
- US20080081173A1 Microstructure and method of manufacturing the same Public/Granted day:2008-04-03
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