Invention Grant
- Patent Title: Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
- Patent Title (中): 底漆,带树脂的导体箔,层叠片及其制造方法
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Application No.: US10557728Application Date: 2004-05-21
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Publication No.: US07648770B2Publication Date: 2010-01-19
- Inventor: Kenji Tanaka , Kazumasa Takeuchi , Nobuyuki Ogawa , Katsuyuki Masuda
- Applicant: Kenji Tanaka , Kazumasa Takeuchi , Nobuyuki Ogawa , Katsuyuki Masuda
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-143940 20030521; JP2003-144059 20030521
- International Application: PCT/JP2004/007326 WO 20040521
- International Announcement: WO2005/007756 WO 20050127
- Main IPC: B32B15/08
- IPC: B32B15/08

Abstract:
The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.
Public/Granted literature
- US20070185297A1 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet Public/Granted day:2007-08-09
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