Invention Grant
US07648775B2 Ceramic substrate, ceramic package for housing light emitting element
有权
陶瓷基板，用于外壳发光元件的陶瓷封装
- Patent Title: Ceramic substrate, ceramic package for housing light emitting element
- Patent Title (中): 陶瓷基板，用于外壳发光元件的陶瓷封装
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Application No.: US11291965Application Date: 2005-12-02
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Publication No.: US07648775B2Publication Date: 2010-01-19
- Inventor: Hisashi Wakako , Makoto Nagai , Atsushi Uchida , Masahito Morita , Kazuo Kimura
- Applicant: Hisashi Wakako , Makoto Nagai , Atsushi Uchida , Masahito Morita , Kazuo Kimura
- Applicant Address: JP Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2004-350927 20041203; JPP.2005-038775 20050216; JPP.2005-084449 20050323
- Main IPC: B32B15/00
- IPC: B32B15/00
Abstract:
A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.
Public/Granted literature
- US20060147746A1 Ceramic substrate, ceramic package for housing light emitting element Public/Granted day:2006-07-06
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