Invention Grant
- Patent Title: Diagonal corner-to-corner sub-resolution assist features for photolithography
- Patent Title (中): 对角线角对角分辨率辅助光刻技术
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Application No.: US11390779Application Date: 2006-03-27
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Publication No.: US07648803B2Publication Date: 2010-01-19
- Inventor: Sam Sivakumar , Charles H. Wallace , Shannon E. Daviess
- Applicant: Sam Sivakumar , Charles H. Wallace , Shannon E. Daviess
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G03F1/00
- IPC: G03F1/00 ; G06F17/50

Abstract:
Diagonal corner-to-corner sub-resolution assist features for use in photolithography are described. The diagonal features may be applied to one or a group of main features. Such features may be developed starting by synthesizing a photolithography mask having a first feature aligned along a linear axis and having a corner and a second feature aligned along a linear axis and having a corner, the corners of first and second features being separated from each other by a gap. The features may be developed by determining at least one diagonal line between the corners of the features to bridge the gap between the corners, applying a sub-resolution assist feature along the determined line, and modifying the synthesized photolithography mask to include the sub-resolution assist feature.
Public/Granted literature
- US20070224519A1 Diagonal corner-to-corner sub-resolution assist features for photolithography Public/Granted day:2007-09-27
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