Invention Grant
US07648816B2 Positive resist composition, method for forming resist pattern and compound
有权
正性抗蚀剂组合物,形成抗蚀剂图案和化合物的方法
- Patent Title: Positive resist composition, method for forming resist pattern and compound
- Patent Title (中): 正性抗蚀剂组合物,形成抗蚀剂图案和化合物的方法
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Application No.: US11817012Application Date: 2006-02-20
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Publication No.: US07648816B2Publication Date: 2010-01-19
- Inventor: Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant: Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2005-051219 20050225
- International Application: PCT/JP2006/302961 WO 20060220
- International Announcement: WO2006/090667 WO 20060831
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; C07C39/04

Abstract:
A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) contains a compound (A1), in which either a portion of, or all of, the hydrogen atoms of phenolic hydroxyl groups within a polyhydric phenol compound with a molecular weight of 300 to 2,500 represented by a general formula (I) shown below have been substituted with at least one group selected from the group consisting of acid-dissociable, dissolution-inhibiting groups represented by a general formula (II) shown below and acid-dissociable, dissolution-inhibiting groups represented by a general formula (III) shown below.
Public/Granted literature
- US20090035691A1 POSITIVE RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND COMPOUND Public/Granted day:2009-02-05
Information query
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